1. CAE/CAD application to electronic packaging: presented at 1994 International Mechanical Engineering Congress and Exposition, Chicago, Illinois, November 6-11, 1994
پدیدآورنده :
کتابخانه: Central Library of Sharif University of Technology (Tehran)
موضوع : Congresses ، Heat sinks )Electronics(,Congresses ، Electronic packaging,Congresses ، Heat sinks )Electronics(,Congresses ، Electronic packaging
رده :
TK
7870
.
15
.
C33
1994
